c 3 - 1 n 0 s - 1 0 (a) (b) (d) 1. part no. expression : (b) inductance code : 1n0 = 1.0nh (c) tolerance code : s = 0.3nh, j = 5% (a) series code 2. configuration & dimensions : superworld electronics (s) pte ltd (d) 10 : rohs compliant 3. general specification : b) storage temp. : -10c to +40c a) operating temp. : -40c to +85c c3 series ceramic chip inductors pg. 1 note : specifications subject to change without notice. please check our website for latest information. 04.06.2009 1.250.2 b unit:m/m 2.00.2 a c 0.850.2 c a d b 1.250.2 c) humdity range : 70% rh max. d) resistance to solder heat : 265c.6secs (c) d 0.2 ~ 0.8
superworld electronics (s) pte ltd ceramic chip inductors c3 series note : specifications subject to change without notice. please check our website for latest information. pg. 2 04.06.2009 4. electrical characteristics : 18 18 15 15 15 15 15 15 12 15 12 12 q 10 min. 10 10 10 10 12 j : 5% s : 0.3nh 0.85 c3-8n2j-10 tolerance code : c3-22nj-10 c3-27nj-10 c3-18nj-10 c3-12nj-10 c3-10nj-10 c3-15nj-10 0.85 0.85 0.85 0.85 0.85 0.85 c3-4n7s-10 c3-5n6s-10 c3-3n3s-10 c3-3n9s-10 c3-6n8j-10 c3-2n7s-10 0.85 0.85 0.85 0.85 0.85 0.85 8.2 22 27 18 12 10 15 3.9 5.6 4.7 6.8 3.3 2.7 part number c3-1n0s-10 c3-1n8s-10 c3-1n5s-10 c3-2n2s-10 C3-1N2S-10 0.85 0603 0603 0.85 0.85 dim. c 0.2 1.2 1.8 1.5 2.2 ( nh ) inductance 1.0 frequency 100 ( mhz ) 100 test 18 18 18 18 18 c3-56nj-10 c3-68nj-10 c3-47nj-10 c3-33nj-10 c3-39nj-10 0.85 0.85 0.85 0.85 0.85 56 68 47 33 39 18 13 18 c3-r10j-10 c3-r12j-10 c3-82nj-10 0.85 0.85 0.85 100 120 82 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 50 100 0.28 0.50 0.55 0.45 0.35 0.30 0.40 0.15 0.23 0.20 0.25 0.13 0.10 0.10 0.10 0.10 0.10 (
) dcr 0.10 max. 0.75 0.80 0.70 0.60 0.65 0.90 0.95 0.90 2.4 1.4 1.3 1.5 1.6 1.9 2.1 4.0 3.2 2.8 3.5 4.0 4.0 ( ghz ) 10 4.0 4.0 4.0 min. 10 srf 0.8 0.7 0.9 1.0 1.2 0.6 0.5 0.6 300 300 300 300 300 300 300 300 300 300 300 300 300 rated current 300 300 300 300 ( ma ) max. 300 300 300 300 300 300 300 300 300 13 12 13 c3-r18j-10 c3-r22j-10 c3-r15j-10 1.25 1.25 1.25 180 220 150 50 50 50 1.10 1.20 1.00 0.4 0.35 0.5 300 300 300 12 c3-r27j-10 1.25 270 50 1.30 0.3 300 12 c3-r33j-10 1.25 330 50 1.40 0.25 300 10 c3-r39j-10 1.25 390 50 1.40 0.25 300 10 c3-r47j-10 1.25 470 50 1.50 0.20 300 10 c3-r56j-10 1.25 560 25 5.00 0.18 50 10 c3-r68j-10 1.25 680 25 5.50 0.16 50
note : specifications subject to change without notice. please check our website for latest information. superworld electronics (s) pte ltd pg. 3 04.06.2009 ceramic chip inductors c3 series 5. characteristics curves : inductance vs. frequency characteristics q vs. frequency characteristics
note : specifications subject to change without notice. please check our website for latest information. superworld electronics (s) pte ltd pg. 4 04.06.2009 ceramic chip inductors c3 series 6. reliability & test condition : inductance : within 20% of initial value. step2 : room temperature 2 to 5 minutes ambient temperature measurement : after placing for 24 hours (min.) at room step4 : room temperature 2 to 5 minutes step3 : +852c 303 min. number of cycles : 100 45 0.8 45 bending electrical and mechanical characteristics shall consult standard j-std-002 consult standard mil-std-202 appearance : no significant abnormality appearance : no mechanical damage. inductance : within 20% of initial value. appearance : no mechanical damage. inductance : within 20% of initial value. more than 95% coverage of all metabolised area appearance : no mechanical damage. temperature cycle high temperature humidity resistance resistance solderability method 210 be satisfied resistance to solder heat dip time : 31sec. applied current : rated current (max. value) applied current : rated current (max. value) ambient temperature measurement : after placing for 24 hours (min.) at room ambient temperature measurement : after placing for 24 hours (min.) at room temperature : 602c duration : 100812hrs condition for 1 cycle step1 : -403c 303 min. duration : 100812hrs temperature : 852c humidity : 90~95% rh. measurement to be made after keeping at room temp solder : sn-ag3.0-cu0.5 dip time : 61sec. for 242hrs solder temperature : 2653c solder temperature : 2405c solder : sn-ag3.0-cu0.5 preheat : 100 ~ 150c, 60sec. 100 40 unit : mm performance dcr : shall be satisfied appearance : no significant abnormality appearance : no significant abnormality impedance change : within 30% dcr : shall be satisfied inductance change : within 20% substrate bending strength terminal strength dc resistance item soldering shall be done in accordance with the by 3mm hold for 10s and then return. recommended pc board pattern and reflow soldering solder a chip on a test substrate, bend the substrate solder chip on pcb and applied 10n (1.02kgf) for 10sec hp4338 digital milli-ohm meter test condition
superworld electronics (s) pte ltd note : specifications subject to change without notice. please check our website for latest information. pg. 5 04.06.2009 ceramic chip inductors c3 series 6. reliability & test condition : appearance : no mechanical damage. inductance : within 20% of initial value. performance appearance : no mechanical damage. inductance : within 20% of initial value. inductance : within 20% of initial value. appearance : no mechanical damage. vibration test thermal shock item low temperature storage test frequency : 10-55-10hz for 1 min. a period of 2 hours in each of 3 mutually perpendicular directions & times : x, y, z directions for 2 hours. directions (total 6 hours). amplitude : 1.5mm(peak-peak) test condition ambient temperature ambient temperature temperature : -40c, +85c kept stabilized for measurement : after placing for 24 hours (min.) at room measurement : after placing for 24 hours (min.) at room waveform : sine wave 30 minutes each cycle : 100 cycles temperature : -402c duration : 100812hrs
note : specifications subject to change without notice. please check our website for latest information. superworld electronics (s) pte ltd pg. 6 04.06.2009 ceramic chip inductors c3 series c d temperature a b temperature c b) 280c tip temperature (max) c) never contact the ceramic with the iron tip a) preheat circuit and products to 150c. accordingly increasing the solder volume, the mechanical stress to product is also increased. exceeding solder volume may cause the failure of mechanical or electrical performance. solder shall be used not to be exceed as shown in right side. 7-3. solder volume : 7-2. soldering iron a soldering iron must be employed the following precautions are recommended. products attachment with soldering iron is discouraged due to the inherent process control limitations. in the event that note : e) use a 30 watt max. soldering iron with tip diameter of 3.0mm f) limit soldering time to 3 secs. t upper limit recommendable d) 3.0mm tip diameter (max) time(sec.) (melting area of solder) 255 ~ 260 no. of mounting peak temperature peak hold time e times 3 sec c 10 max. main heating pre-heating normal 230c insufficient pre-heating may cause cracks on the ferrite , resulting in the deterioration of product quality. also cooling into the solvent after soldering should be in such a way that the temperature difference is limited to 100c max. pre-heating should be in such a way that the temperature difference between solder and ferrite surface is limited to 150c max. products should be soldered within the following allowable range indicated by the slanted line. the excessive soldering conditi ons 7-1. reflow soldering conditions may cause the corrosion of the electrode. when solder ing is repeated, allowable time is the accumulated time. 7. soldering : 180c 120c e c/sec a slope of temp. rise 1 to 5 50 to 150 120 to 180 90 ~ 120 heat temperature slope of temp. rise time over 230c c d heat time b c c/sec sec 1 to 5 sec
superworld electronics (s) pte ltd note : specifications subject to change without notice. please check our website for latest information. pg. 7 04.06.2009 ceramic chip inductors c3 series d0(mm) p0(mm) p1(mm) e(mm) p2(mm) w(mm) b(mm) a(mm) f(mm) 1.750.10 2.250.05 1.450.05 8.000.10 3.500.05 2.000.05 4.000.10 4.000.10 8-1. paper carrier tape packaging 8. packaging information : t(mm) 0.950.05 1.550.05 b unreeling direction w f e p2 p1 a d0 p0 t 400 ~ 560mm 20 max. w2(mm) n r1.0 2 1 0 . 8 a w2 20.5 1 3 . 0 0 . 5 8-3. configuration w1 50 min. n(mm) a(mm) 1782.0 101.5 w1(mm) 4000/reel qty (pcs) empty compartments components trailer 110mm or more end 8-2. leader and trailer tape 20 pitch or more leader start
superworld electronics (s) pte ltd note : specifications subject to change without notice. please check our website for latest information. pg. 8 04.06.2009 ceramic chip inductors c3 series 2. transportation : a) products should be handled with care to avoid damag e or contamination from perspiration and skin oils. c) bulk handling should ensure that abrasion and mechanical shock are minimized. b) the use of tweezers or vacuum pick up is strongly recommended for individual components. c) the packaging material should be kept where no chlorine or sulfur exists in the air. b) recommended products should be used within 6 months from the time of delivery. a) temperature and humidity conditions : less than 40c and 70% rh. 8-5. packaging 3. maximum of 6 inner boxes shall be packed in an outer box 2. maximum of 5 bags shall be packed in an inner box 1. reel and a bag of desiccant shall be packed in nylon or plastic bag application notice 1. storage conditions : to maintain the solderabililty of terminal electrodes : 8-4. tearing off force peel speed : 300mm/min top cover tape base tape f 165 to 180 10g ~ 100g cover tape peeling strength of cover tape
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